- In-situ stack 3D film
- TSV passivation thin film
Quanta System is designed to provide solution for the latest 3D NAND device fabrication with its excellent integration adaptabilityand film controllability. With minimal defect counts, it delivers In-situ process of alternating layer of films with excellent stressand roughness control. Our unique hardware design enables high-throughput and allows excellent reliability and enhanced up-time for manufacturers.
PECVD(Plasma-Enhanced Chemical Vapor Deposition)
3D NAND manufacturing process starts with depositing multiple alternating layers of materials such as Oxide and Nitride films. Each thin layer must be highly uniform, extremely smooth and with goodadhesion to subsequent layers which can help increase the 3D NAND device density.
QUANTA SYSTEM provides process solution for Oxide, Nitride (ON) stack with management of film uniformity, stress,roughness and controllable WER. Our QUANTA system can provide solution for 3D NAND device fabrication for highercapacity and advanced performance.
1. High Throughput
2. Excellent Integration Adaptability & Controllability
→Stack & Single Stress, Thickness Profile (Center
3. Wide Process Tuning Knob
→Gap, Pressure, Gas Ratio, Wide RF Window.
4. Extreme Stack Film Stability
5. System Performance Reliability
6. Simple Design for Easy Maintenance (High System Reliability & System Uptime)
7. Expanded RF Control Margin