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PECVD QUANTA

PECVD (QUANTA PECVD 系统设备) 应用于淀积二氧化硅(HT-TEOS)薄膜,氮氧化硅(HT-SiON)薄膜,HT-PEOX薄膜等多种3D原位堆积薄膜和TSV钝化薄膜为最新的3D NAND闪存器件制造提供解决方案,具有出色的集成适应性和薄膜可控性极少的缺陷数,可提供具有出色薄膜应力和粗糙度控制的薄膜交替层的原位工艺采用独特的硬件设计可实现高吞吐量,并为器件制造商提供极高可靠性和提高运作时间层间精度高,优异的薄

Process

- HT-TEOS

- HT-SiN

- HT-PEOX


Applications

- In-situ stack 3D film

- TSV passivation thin film


Introduction.

Quanta System is designed to provide solution for the latest 3D NAND device fabrication with its excellent integration adaptabilityand film controllability. With minimal defect counts, it delivers In-situ process of alternating layer of films with excellent stressand roughness control. Our unique hardware design enables high-throughput and allows excellent reliability and enhanced up-time for manufacturers.


Technology.

PECVD(Plasma-Enhanced Chemical Vapor Deposition)

3D NAND manufacturing process starts with depositing multiple alternating layers of materials such as Oxide and Nitride films. Each thin layer must be highly uniform, extremely smooth and with goodadhesion to subsequent layers which can help increase the 3D NAND device density.

QUANTA SYSTEM provides process solution for Oxide, Nitride (ON) stack with management of film uniformity, stress,roughness and controllable WER. Our QUANTA system can provide solution for 3D NAND device fabrication for highercapacity and advanced performance.


Features.

1. High Throughput

2. Excellent Integration Adaptability & Controllability

→Stack & Single Stress, Thickness Profile (Center

3. Wide Process Tuning Knob

→Gap, Pressure, Gas Ratio, Wide RF Window.

4. Extreme Stack Film Stability

5. System Performance Reliability

6. Simple Design for Easy Maintenance (High System Reliability & System Uptime)

7. Expanded RF Control Margin